Becoming an LED packaging enterprise with high core value
-Specification: TO LED
-Power: 150MW
-Number of chips: single core
-Chip brand: Wafer
-Luminous angle: 120 °
-Glow color: invisible light
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| Model | Spectral response (nm) | Photocurrent (mA) | Reverse breakdown voltage (VR) | Angle (deg) |
| TO LED | 700-1100 | 1.0-3.0 | 32V | 120 ° |
Household appliances, medical devices, spatial optical communication, infrared cameras, fixed lasers, automatic card swiping systems for transportation, cameras, security monitoring, anti-theft alarms, infrared waterproofing, etc.
Address: 5th Floor, Building 12, Changfeng Industrial Park, Dongkeng, Fenghuang Street, Guangming District, Shenzhen, Guangdong Province
Tel: 13632942401
Email: [email protected]
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